Global Embedded Die Packaging Technology Market to Generate
Portland, OR, June 02, 2022 (GLOBE NEWSWIRE) — According to the report released by Allied Market Research, the global embedded die packaging technology market generated $63.93 million in 2020 and is expected to generate $311.41 million by 2030, growing at a CAGR of 18.2% from 2021 to 2030. The report offers a detailed analysis of the changing trends in the market, value chain, major segments, key investment pockets, regional scenarios, and competitive landscape.
Rising requirements for electronic circuit miniaturization in microelectronic devices is driving the growth of the global integrated chip packaging technology market. However, the high upfront costs of packaging embedded chips are hampering the growth of the market. On the other hand, the increase in the adoption of smartphones and smart wearable devices is creating new opportunities in the coming years.
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- The global economy has been disrupted by the unprecedented pandemic situation, and the embedded die packaging technology market has been negatively impacted, especially in the early stages.
- Production facilities have slowed down due to the Covid-19 outbreak, which in turn has improved the demand for electronics and semiconductor products in these industries. Its key implications include a major manufacturing shutdown in Europe and a halt in Chinese material exports, both of which are hampering the expansion of the integrated die packaging technology market.
The report offers a detailed segmentation of the global Integrated Die Packaging Technology market based on platform, industry vertical, and region.
Based on the platform, the chip embedded in the substrate segment of the IC package held the highest market share in 2020, accounting for nearly half of the total share, and is expected to maintain its leading status over the forecast period. However, the embedded chip in the flexible card segment is expected to grow at the fastest CAGR of 20.4% from 2021 to 2030.
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Based on the industry vertical, the consumer electronics segment accounted for the largest share in 2020, contributing almost half of the global embedded chip packaging technology market, and is expected to maintain its leading position during the forecast period. However, the healthcare segment is expected to show the highest CAGR of 21.2% from 2021 to 2030.
Based on region, Asia-Pacific contributed the highest share in 2020, accounting for about half of the total share, and is expected to retain its dominant revenue share by 2030. Moreover, this same segment is expected to manifest the highest CAGR of 19.7% during the forecast period.
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Key players in the global embedded chip packaging technology market covered in the research include Taiwan Semiconductor Manufacturing Company, Amkor Technology, AT&S, ASE Group. General Electric, Fujikura, Infineon, MicroSemi, Schweizer and TDK-Epcos.
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Allied Market Research (AMR) is a full-service market research and business consulting wing of Allied Analytics LLP based in Portland, Oregon. Allied Market Research provides global corporations as well as small and medium enterprises with unrivaled quality of “market research reports” and “Business Intelligence solutions”. AMR has a focused vision to provide business insights and advice to help its clients make strategic business decisions and achieve sustainable growth in their respective market area.
Pawan Kumar, CEO of Allied Market Research, leads the organization in delivering high quality data and insights. We maintain professional relationships with various companies which helps us to extract market data which helps us to generate accurate research data tables and confirm the utmost accuracy of our market predictions. All data presented in the reports we publish are drawn from primary interviews with senior managers of large companies in the relevant field. Our secondary data sourcing methodology includes extensive online and offline research and discussions with knowledgeable industry professionals and analysts.